Hanmi Semiconductor, the world's top maker of HBM bonding equipment, is moving into advanced packaging tools for AI system ...

Shares in JCET Group continued to surge after China's largest semiconductor packaging and testing provider said it plans to invest more than $1 billion to boost its advanced chip-packaging capacity.

The semiconductor industry is one of the most advanced and complex in the world. The semiconductor industry relies on highly ...

Applied Materials rides AI-led chip demand with stronger growth forecasts and lower valuation, while KLA trails with premium pricing after a sharp rally.

TSMC is preparing to mass-produce panel-level packaging (PLP), a next-generation chip-packaging technology — setting up a ...

Companies building the largest AI accelerators face a growing cost problem that has nothing to do with transistors. The ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...

Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by ...

ISDN HOLDINGS (01656.HK) 0.000 (0.000%) announced that its 66.5%-owned subsidiary, IDI Dynamics, has launched a ...

Sanand (Gujarat): It’s about 47 degrees outside. Inside, it feels 20. Deepa Jayasri, a recent electronics engineering graduate from LDRP Institute of Technology and Research College in Gandhinagar, is ...